JOSHUA DEPIVER


NameJOSHUA DEPIVER
Research instituteCollege of Science and Engineering

Research outputs

Thermo-mechanical reliability studies of lead-free solder interconnects

Depiver, Joshua Adeniyi 2021. Thermo-mechanical reliability studies of lead-free solder interconnects. Thesis

Thermal Fatigue Life of Ball Grid Array (BGA) Solder Joints Made From Different Alloy Compositions

Depiver, Joshua Adeniyi, Sabuj, Mallik and Amalu, Emeka H 2021. Thermal Fatigue Life of Ball Grid Array (BGA) Solder Joints Made From Different Alloy Compositions. Engineering Failure Analysis. https://doi.org/10.1016/j.engfailanal.2021.105447

Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications

Depiver, Joshua Adeniyi, Sabuj, Mallik, Amalu, Emeka H and Lu, Yiling 2021. Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications. Production and Manufacturing Research.

Effective solder for improved thermo-mechanical reliability of solder joints in ball grid array (BGA) soldered on printed circuit board (PCB)

Depiver, Joshua Adeniyi, Sabuj, Mallik and Amalu, Emeka H 2020. Effective solder for improved thermo-mechanical reliability of solder joints in ball grid array (BGA) soldered on printed circuit board (PCB). Springer. https://doi.org/10.1007/s11664-020-08525-9

Comparing and benchmarking fatigue behaviours of various sac solders under thermo-mechanical loading

Depiver, Joshua Adeniyi, Mallik, Sabuj and Amalu, Emeka H 2020. Comparing and benchmarking fatigue behaviours of various sac solders under thermo-mechanical loading. IEEE. https://doi.org/10.1109/ESTC48849.2020.9229699

Solder joint failures under thermo-mechanical loading conditions – a review

Depiver, Joshua Adeniyi, Mallik, Sabuj and Harmanto, Dani 2020. Solder joint failures under thermo-mechanical loading conditions – a review. Advances in Materials and Processing Technologies. https://doi.org/10.1080/2374068X.2020.1751514

Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageing

Depiver, Joshua Adeniyi, Mallik, Sabuj, Amalu, Emeka H and Harmanto, Dani 2019. Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageing. IEEE Xplore.

Creep response of various solders used in soldering ball grid array (BGA) on printed circuit board (PCB)

Depiver, Joshua Adeniyi, Mallik, Sabuj and Amalu, Emeka H 2019. Creep response of various solders used in soldering ball grid array (BGA) on printed circuit board (PCB). Newsroom Limited.
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