Characterising Solder Materials from Random Vibration Response of their Interconnects in BGA Packaging
Journal article
Authors | DEPIVER, J., Mallik, S. and Amalu, E. H. |
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Abstract | Solder interconnection in electronic packaging is the weakest link, thus driving the reliability of electronic modules and systems. Improving interconnection integrity in safety-critical applications is vital in enhancing application reliability. This investigation qualifies the random vibration response of five essential solder compositions in ball grid array (BGA) solder joints used in safety-critical applications. The solder compositions are eutectic Sn63Pb37 and SnAgCu (SAC) 305, 387, 396, and 405. Computer-aided engineering (CAE) employing ANSYS FEA and SolidWorks software is implemented in this investigation. The solder Sn63Pb37 deformed least at 0.43 µm, followed by SAC396 at 0.58 µm, while SAC405 deformed highest at 0.88 µm. |
Keywords | solder joints; electronic packaging; fatigue failure |
Year | 2023 |
Journal | Journal of Electronic Materials |
Journal citation | pp. 1-17 |
Publisher | Springer |
ISSN | 0361-5235 |
Digital Object Identifier (DOI) | https://doi.org/10.1007/s11664-023-10394-x |
Web address (URL) | https://link.springer.com/search?query=&search-within=Journal&facet-journal-id=11664 |
Publisher's version | License File Access Level Open |
Output status | Published |
Publication dates | |
Online | 23 Apr 2023 |
Publication process dates | |
Accepted | 16 Mar 2023 |
Deposited | 09 May 2023 |
Supplemental file | File Access Level Restricted |
https://repository.derby.ac.uk/item/9xv71/characterising-solder-materials-from-random-vibration-response-of-their-interconnects-in-bga-packaging
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Publisher's version
Characterising Solder Materials from Random Vibration Response of their Interconnects in BGA Packaging[32].docx | ||
License: CC BY 4.0 | ||
File access level: Open |
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