Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics.

Journal article


Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I., Mallik, Sabuj and Otiaba, Kenny 2013. Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability. https://doi.org/10.1016/j.microrel.2013.08.006
AuthorsEkpu, Mathias, Bhatti, Raj, Okereke, Michael I., Mallik, Sabuj and Otiaba, Kenny
Abstract

Microelectronics failure during operation is commonly attributed to ineffective heat management within the system. Hence, reliability of such devices becomes a challenge area. The use of lead-free solders as thermal interface materials to improve the heat conduction between a chip level device and a heat sink is becoming popular due to their promising thermal and mechanical material properties. Finite element modelling was employed in the analysis of the fatigue life of three lead-free solders (SAC105, SAC305, and SAC405) under commercial thermal cycling load (between −40 °C and 85 °C). This paper presents the results of the simulation work focusing on the effect of varying the solder thermal interface thickness (or bond line thickness) on the reliability of the microelectronic device. The results obtained were based on stress, strain, deformation, and plastic work density. The results showed that the fatigue life of the three solders increases as the solder thermal interface thickness increases. Also, the stresses, strains, and deformation were highest around the edges and vertices of the solder interface. In addition, the optimal solder material of choice based on the criteria of this research is given as SAC405. It has higher operational life span and good reliability capabilities.

KeywordsMicroelectronics; Soldering
Year2013
JournalMicroelectronics Reliability
PublisherElsevier
ISSN00262714
Digital Object Identifier (DOI)https://doi.org/10.1016/j.microrel.2013.08.006
Web address (URL)http://hdl.handle.net/10545/622573
hdl:10545/622573
Publication dates03 Sep 2013
Publication process dates
Deposited07 Apr 2018, 12:03
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ContributorsUniversity of Greenwich
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