Sabuj Mallik


NameSabuj Mallik
Job titleHead of Discipline - Engineering
Research instituteCollege of Science and Engineering

Research outputs

Characterising Solder Materials from Random Vibration Response of their Interconnects in BGA Packaging

DEPIVER, J., Mallik, S. and Amalu, E. H. 2023. Characterising Solder Materials from Random Vibration Response of their Interconnects in BGA Packaging. Journal of Electronic Materials. pp. 1-17. https://doi.org/10.1007/s11664-023-10394-x

Effects of reflow profile and miniaturisation on integrity of solder joints in surface mount chip resistor

Njoku, J. E., Amalu, E. H., Ekere, N., Mallik, S., Ekpu, M. and Ogbodo, E. A. 2023. Effects of reflow profile and miniaturisation on integrity of solder joints in surface mount chip resistor. Journal of Electronic Materials. pp. 1-11. https://doi.org/10.1007/s11664-023-10340-x

Cure mechanism and kinetic prediction of biobased glass/polyfurfuryl alcohol prepreg by model-free kinetics

Odiyi, D., Sharif, T., Choudhry, R.S. and Mallik, S. 2022. Cure mechanism and kinetic prediction of biobased glass/polyfurfuryl alcohol prepreg by model-free kinetics. Thermochimica Acta. 708, p. 179133. https://doi.org/10.1016/j.tca.2021.179133

Thermal Fatigue Life of Ball Grid Array (BGA) Solder Joints Made From Different Alloy Compositions

Depiver, Joshua Adeniyi, Sabuj, Mallik and Amalu, Emeka H 2021. Thermal Fatigue Life of Ball Grid Array (BGA) Solder Joints Made From Different Alloy Compositions. Engineering Failure Analysis. https://doi.org/10.1016/j.engfailanal.2021.105447

Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications

Depiver, Joshua Adeniyi, Sabuj, Mallik, Amalu, Emeka H and Lu, Yiling 2021. Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications. Production and Manufacturing Research.

Effective solder for improved thermo-mechanical reliability of solder joints in ball grid array (BGA) soldered on printed circuit board (PCB)

Depiver, Joshua Adeniyi, Sabuj, Mallik and Amalu, Emeka H 2020. Effective solder for improved thermo-mechanical reliability of solder joints in ball grid array (BGA) soldered on printed circuit board (PCB). Springer. https://doi.org/10.1007/s11664-020-08525-9

Comparing and benchmarking fatigue behaviours of various sac solders under thermo-mechanical loading

Depiver, Joshua Adeniyi, Mallik, Sabuj and Amalu, Emeka H 2020. Comparing and benchmarking fatigue behaviours of various sac solders under thermo-mechanical loading. IEEE. https://doi.org/10.1109/ESTC48849.2020.9229699

Solder joint failures under thermo-mechanical loading conditions – a review

Depiver, Joshua Adeniyi, Mallik, Sabuj and Harmanto, Dani 2020. Solder joint failures under thermo-mechanical loading conditions – a review. Advances in Materials and Processing Technologies. https://doi.org/10.1080/2374068X.2020.1751514

Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageing

Depiver, Joshua Adeniyi, Mallik, Sabuj, Amalu, Emeka H and Harmanto, Dani 2019. Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageing. IEEE Xplore.

Creep response of various solders used in soldering ball grid array (BGA) on printed circuit board (PCB)

Depiver, Joshua Adeniyi, Mallik, Sabuj and Amalu, Emeka H 2019. Creep response of various solders used in soldering ball grid array (BGA) on printed circuit board (PCB). Newsroom Limited.

Quantitative evaluation of voids in lead free solder joints.

Mallik, Sabuj, Njoku, Jude and Takyi, Gabriel 2015. Quantitative evaluation of voids in lead free solder joints. Applied Mechanics and Materials. https://doi.org/10.4028/www.scientific.net/AMM.772.284

Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint.

Bernasko, Peter K., Mallik, Sabuj and Takyi, Gabriel 2015. Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint. Soldering & Surface Mount Technology. https://doi.org/10.1108/SSMT-07-2013-0019

CFD simulation of solder paste flow and deformation behaviours during stencil printing process.

Thakur, Vishal, Mallik, Sabuj and Vuppala, Vamsi 2015. CFD simulation of solder paste flow and deformation behaviours during stencil printing process. International Journal of Recent Advances in Mechanical Engineering. https://doi.org/10.14810/ijmech.2015.4101

A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints.

Nath, Jyotishman, Mallik, Sabuj and Borah, Anil 2015. A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints. Journal of The Institution of Engineers (India): Series D. https://doi.org/10.1007/s40033-014-0063-3

Printing morphology and rheological characteristics of lead-free Sn-3Ag-0.5Cu (SAC) solder pastes.

Sharma, Ashutosh, Mallik, Sabuj, Ekere, Nduka N. and Jung, Jae-Pil 2014. Printing morphology and rheological characteristics of lead-free Sn-3Ag-0.5Cu (SAC) solder pastes. Journal of the Microelectronics and Packaging Society. https://doi.org/10.6117/kmeps.2014.21.4.083

Effect of reflow profile parameters on surface mount chip resistor solder joint shear strength.

Bernasko, Peter K., Mallik, Sabuj and Takyi, Gabriel 2014. Effect of reflow profile parameters on surface mount chip resistor solder joint shear strength. International Journal of Materials Science and Applications. https://doi.org/10.11648.j.ijmsa.20140305.27

The effect of thermal constriction on heat management in a microelectronic application.

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I., Mallik, Sabuj and Otiaba, Kenny 2013. The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal. https://doi.org/10.1016/j.mejo.2013.10.011

Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics.

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I., Mallik, Sabuj and Otiaba, Kenny 2013. Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability. https://doi.org/10.1016/j.microrel.2013.08.006
  • 307
    total views of outputs
  • 24
    total downloads of outputs
  • 1
    views of outputs this month
  • 0
    downloads of outputs this month