Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageing

Conference item


Depiver, Joshua Adeniyi, Mallik, Sabuj, Amalu, Emeka H and Harmanto, Dani 2019. Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageing. IEEE Xplore.
AuthorsDepiver, Joshua Adeniyi, Mallik, Sabuj, Amalu, Emeka H and Harmanto, Dani
Abstract

Solder joints of electronic components are the most critical part of any electronic device. Their untimely failure during the system’s operation often culminates in catastrophic failure of the device. The determination of creep damage in electronic component solder joint is vital to the prediction of crack initiation and prevention of premature failure. This paper presents the creep damage in solder joints in a ball grid array (BGA) soldered on a printed circuit board (PCB) and subjected to thermal cycling as well as isothermal ageing. ANSYS 19.0 package is employed to model the isothermal gaining at -40, 25, 75 and 150℃ temperatures for 45 days. Standard temperature cycle profile is used to simulate the effect of the coefficient of thermal expansion mismatch on the bonded materials in the BGA component. The solders studied are lead-based eutectic solder alloy and lead-free SAC396, SAC387, and SAC305. Based on the results obtained for the stress, strain and strain energy of the solders, the research investigation advises on the most effective solder for achieving improvement in the thermo-mechanical reliability of solder joints in BGA soldered on PCB.

Keywordsstrain; thermal cycling; isothermal ageing; strain energy; ball gird array; thermo-mechanical
Year2019
JournalIEEE
PublisherIEEE Xplore
Web address (URL)http://hdl.handle.net/10545/624386
http://creativecommons.org/publicdomain/zero/1.0/
hdl:10545/624386
ISBN9781538630426
File
File Access Level
Open
File
File Access Level
Open
File
File Access Level
Open
Publication datesDec 2019
Publication process dates
Deposited14 Jan 2020, 16:45
Accepted01 Sep 2019
Rights

CC0 1.0 Universal

ContributorsUniversity of Derby
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https://repository.derby.ac.uk/item/93553/creep-damage-of-bga-solder-interconnects-subjected-to-thermal-cycling-and-isothermal-ageing

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