Quantitative evaluation of voids in lead free solder joints.
|Authors||Mallik, Sabuj, Njoku, Jude and Takyi, Gabriel|
Voiding in solder joints poses a serious reliability concern for electronic products. The aim of this research was to quantify the void formation in lead-free solder joints through X-ray inspections. Experiments were designed to investigate how void formation is affected by solder bump size and shape, differences in reflow time and temperature, and differences in solder paste formulation. Four different lead-free solder paste samples were used to produce solder bumps on a number of test boards, using surface mount reflow soldering process. Using an advanced X-ray inspection system void percentages were measured for three different size and shape solder bumps. Results indicate that the voiding in solder joint is strongly influenced by solder bump size and shape, with voids found to have increased when bump size decreased. A longer soaking period during reflow stage has negatively affectedsolder voids. Voiding was also accelerated with smaller solder particles in solder paste.
|Keywords||X-ray; Soldering; Mechanical engineering|
|Journal||Applied Mechanics and Materials|
|Publisher||Trans Tech Publications Inc.|
|Digital Object Identifier (DOI)||https://doi.org/10.4028/www.scientific.net/AMM.772.284|
|Web address (URL)||http://hdl.handle.net/10545/622472|
|Publication dates||Jul 2015|
|Publication process dates|
|Deposited||29 Mar 2018, 10:49|
Archived with thanks to Applied Mechanics and Materials
|Contributors||Unviersity of Derby, University of Greenwich and Kwame Nkrumah University|
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