Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications

Journal article


Depiver, Joshua Adeniyi, Sabuj, Mallik, Amalu, Emeka H and Lu, Yiling 2021. Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications. Production and Manufacturing Research.
AuthorsDepiver, Joshua Adeniyi, Sabuj, Mallik, Amalu, Emeka H and Lu, Yiling
Abstract

Electronic manufacturing is one of the dynamic industries in the world in terms of leading in technological advancements. At the heart of electronic assembly lies the 'soldering technology' and the 'solder joints' between electronic components and substrate. During the operation of electronic products, solder joints experience harsh environmental conditions in terms of cyclic change of temperature and vibration and exposure to moisture and chemicals. Due to the cyclic application of loads and higher operational temperature, solder joints fail primarily through creep and fatigue failures. This paper presents the creep-fatigue behaviours of solder joints in a ball grid array (BGA), soldered on a printed circuit board (PCB). Using finite element (FE) simulation, the solder joints were subjected to thermal cycling and isothermal ageing. Accelerated thermal cycling (ATC) was carried out using a temperate range from 40℃ to 150℃, and isothermal ageing was done at -40,25,75 and 150℃ temperatures for 45 days (64,800 mins). The solders studied are lead-based eutectic Sn63Pb37 and lead-free SAC305, SAC387, SAC396 and SAC405. The results were analysed using the failure criterion of equivalent stress, strain rate, deformation rate, and the solders' strain energy density. The SAC405 and SAC396 are found to possess the least stress magnitude, strain rate, deformation rate, and strain energy density damage than the lead-based eutectic Sn63Pb37 solder; they have the highest fatigue lives based on the damage mechanisms. This research provides a technique for determining the preventive maintenance time of BGA components in mission-critical systems. Furthermore, it proposes developing a new life prediction model based on a combination of the damage parameters for improved prediction.

KeywordsCreep; Fatigue; Thermal cycling
Year2021
JournalProduction and Manufacturing Research
PublisherTaylor & Francis
Web address (URL)http://hdl.handle.net/10545/626308
http://creativecommons.org/publicdomain/zero/1.0/
hdl:10545/626308
Publication dates2021
Publication process dates
Deposited04 Mar 2022, 14:27
Accepted14 May 2021
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CC0 1.0 Universal

ContributorsUniversity of Derby
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