CFD simulation of solder paste flow and deformation behaviours during stencil printing process.
Journal article
Thakur, Vishal, Mallik, Sabuj and Vuppala, Vamsi 2015. CFD simulation of solder paste flow and deformation behaviours during stencil printing process. International Journal of Recent Advances in Mechanical Engineering. https://doi.org/10.14810/ijmech.2015.4101
| Authors | Thakur, Vishal, Mallik, Sabuj and Vuppala, Vamsi |
|---|---|
| Abstract | In 20th century, Electronics elements have become most significant part of the regular life. The main heart of electronic element is PCB which supports and manages mostly machines and equipments these days. Therefore manufacturing of board and assembly of electronic elements is one of the crucial and significant objectives for most of the companies. Better life of PCB’s depends on electronic elements and its assembly with board. Solder paste is used as adhesive material for assembly purpose. It is deposited on board using stencil and electronic elements are mounted on it and heated for strong bond. This study investigates on factors affecting stencil printing process due to variation in squeegee speed and density of solder paste. This study is based on computational fluid dynamics virtual simulation. Prototype is developed for modelling purpose and simulation software is used to simulate the flow behaviour of solder paste during stencil printing process. |
| Keywords | Computational fluid dynamics (CFD); Solder paste simulation; Stencil printing process simulation; Soldering |
| Year | 2015 |
| Journal | International Journal of Recent Advances in Mechanical Engineering |
| Publisher | Wireilla Scientific Publications |
| ISSN | 2205854 |
| Digital Object Identifier (DOI) | https://doi.org/10.14810/ijmech.2015.4101 |
| Web address (URL) | http://hdl.handle.net/10545/622570 |
| hdl:10545/622570 | |
| Publication dates | Feb 2015 |
| Publication process dates | |
| Deposited | 07 Apr 2018, 11:27 |
| Contributors | University of Greenwich |
| File | File Access Level Open |
| File | File Access Level Open |
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