CFD simulation of solder paste flow and deformation behaviours during stencil printing process.

Journal article


Thakur, Vishal, Mallik, Sabuj and Vuppala, Vamsi 2015. CFD simulation of solder paste flow and deformation behaviours during stencil printing process. International Journal of Recent Advances in Mechanical Engineering. https://doi.org/10.14810/ijmech.2015.4101
AuthorsThakur, Vishal, Mallik, Sabuj and Vuppala, Vamsi
Abstract

In 20th century, Electronics elements have become most significant part of the regular life. The main heart of electronic element is PCB which supports and manages mostly machines and equipments these days. Therefore manufacturing of board and assembly of electronic elements is one of the crucial and significant objectives for most of the companies. Better life of PCB’s depends on electronic elements and its assembly with board. Solder paste is used as adhesive material for assembly purpose. It is deposited on board using stencil and electronic elements are mounted on it and heated for strong bond. This study investigates on factors affecting stencil printing process due to variation in squeegee speed and density of solder paste. This study is based on computational fluid dynamics virtual simulation. Prototype is developed for modelling purpose and simulation software is used to simulate the flow behaviour of solder paste during stencil printing process.

KeywordsComputational fluid dynamics (CFD); Solder paste simulation; Stencil printing process simulation; Soldering
Year2015
JournalInternational Journal of Recent Advances in Mechanical Engineering
PublisherWireilla Scientific Publications
ISSN2205854
Digital Object Identifier (DOI)https://doi.org/10.14810/ijmech.2015.4101
Web address (URL)http://hdl.handle.net/10545/622570
hdl:10545/622570
Publication datesFeb 2015
Publication process dates
Deposited07 Apr 2018, 11:27
ContributorsUniversity of Greenwich
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