Comparing and benchmarking fatigue behaviours of various sac solders under thermo-mechanical loading

Conference item


Depiver, Joshua Adeniyi, Mallik, Sabuj and Amalu, Emeka H 2020. Comparing and benchmarking fatigue behaviours of various sac solders under thermo-mechanical loading. IEEE. https://doi.org/10.1109/ESTC48849.2020.9229699
AuthorsDepiver, Joshua Adeniyi, Mallik, Sabuj and Amalu, Emeka H
Abstract

While the fatigue behaviours (including fatigue life predictions) of lead-free solder joints have been extensively researched in the last 15 years, these are not adequately compared and benchmarked for different lead-free solders that are being used. As more and more fatigue properties of lead-free solders are becoming available, it is also critical to know how fatigue behaviours differ under different mathematical models. This paper addresses the challenges and presents a comparative study of fatigue behaviours of various mainstream lead-free Sn-Ag-Cu (SAC) solders and benchmarked those with lead-based eutectic solder. Creep-induced fatigue and fatigue life of lead-based eutectic Sn63Pb37 and four lead-free SAC solder alloys: SAC305, SAC387, SAC396 and SAC405 are analysed through simulation studies. The Anand model is used to simulate the inelastic deformation behaviour of the solder joints under accelerated thermal cycling (ATC). It unifies the creep and rate-independent plastic behaviour and it is used to predict the complex stress-strain relationship of solders under different temperatures and strain rates, which are required in the prediction of fatigue life using the fatigue life models such as Engelmaier, Coffin-Mason and Solomon as the basis of our comparison. The ATC was carried out using temperature range from −40°C to 150°C. The fatigue damage propagation is determined with finite element (FE) simulation, which allows virtual prototyping in the design process of electronics devices. The simulation was carried out on a BGA (36 balls, 6 × 6 matrix) mounted onto Cu padded substrate. Results are analysed for plastic strain, Von mises stress, strain energy density, and stress-strain hysteresis loop. The simulation results show that the fatigue behaviours of lead-based eutectic Sn63Pb37 solder is comparable to those of lead-free SAC solders. Among the four SAC solders, SAC387 consistently produced higher plastic strain, strain energy and stress than the other solders. The fatigue life’s estimation of the solder joint was investigated using Engelmaier, Coffin-Manson, and Solomon models. Results obtained show that SAC405 has the highest fatigue life (25.7, 21.1 and 19.2 years) followed by SAC396 (18.7, 20.3 and 17.9 years) and SAC305 (15.2, 13.6 and 16.2 years) solder alloys respectively. Predicting the fatigue life of these solder joints averts problems in electronics design for reliability and quality, which if not taken care of, may result in lost revenue. Predictive fatigue analysis can also considerably reduce premature failure, and modern analysis technique such as one used in this research is progressively helping to provide comprehensive product life expectancy data.

KeywordsFatigue, Von mises stress, Strain energy density, Hysteresis loop, Plastic strain
Year2020
Journal2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
PublisherIEEE
Digital Object Identifier (DOI)https://doi.org/10.1109/ESTC48849.2020.9229699
Web address (URL)http://hdl.handle.net/10545/625351
http://creativecommons.org/publicdomain/zero/1.0/
hdl:10545/625351
File
File Access Level
Open
File
File Access Level
Open
File
File Access Level
Open
Publication dates23 Oct 2020
Publication process dates
Deposited06 Nov 2020, 12:50
Accepted15 Sep 2020
Rights

CC0 1.0 Universal

ContributorsUniversity of Derby
Permalink -

https://repository.derby.ac.uk/item/9478q/comparing-and-benchmarking-fatigue-behaviours-of-various-sac-solders-under-thermo-mechanical-loading

  • 40
    total views
  • 103
    total downloads
  • 0
    views this month
  • 2
    downloads this month

Export as

Related outputs

A review of advancements in synthesis, manufacturing and properties of environment friendly biobased Polyfurfuryl Alcohol Resin and its Composites
Odiyi, D., Sharif, T., Choudhry, R., Mallik, S. and Shah S.Z.H 2023. A review of advancements in synthesis, manufacturing and properties of environment friendly biobased Polyfurfuryl Alcohol Resin and its Composites. Composites Part B: Engineering. 267, pp. 1-15. https://doi.org/10.1016/j.compositesb.2023.111034
An Empirical Study on Convective Drying of Ginger Rhizomes Leveraging Environmental Stress Chambers and Linear Heat Conduction Methodology
Depiver, J. and Mallik, S. 2023. An Empirical Study on Convective Drying of Ginger Rhizomes Leveraging Environmental Stress Chambers and Linear Heat Conduction Methodology. Agriculture. 13 (7), pp. 1-28. https://doi.org/10.3390/agriculture13071322
Effects of reflow profile and miniaturisation on integrity of solder joints in surface mount chip resistor
Njoku, J. E., Amalu, E. H., Ekere, N., Mallik, S., Ekpu, M. and Ogbodo, E. A. 2023. Effects of reflow profile and miniaturisation on integrity of solder joints in surface mount chip resistor. Journal of Electronic Materials. 52, p. 3786–3796. https://doi.org/10.1007/s11664-023-10340-x
Characterising Solder Materials from Random Vibration Response of their Interconnects in BGA Packaging
DEPIVER, J., Mallik, S. and Amalu, E. H. 2023. Characterising Solder Materials from Random Vibration Response of their Interconnects in BGA Packaging. Journal of Electronic Materials. pp. 1-17. https://doi.org/10.1007/s11664-023-10394-x
Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications
Depiver, Joshua Adeniyi, Sabuj, Mallik, Amalu, Emeka H and Lu, Yiling 2021. Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications. Production and Manufacturing Research.
Cure mechanism and kinetic prediction of biobased glass/polyfurfuryl alcohol prepreg by model-free kinetics
Odiyi, D., Sharif, T., Choudhry, R.S. and Mallik, S. 2022. Cure mechanism and kinetic prediction of biobased glass/polyfurfuryl alcohol prepreg by model-free kinetics. Thermochimica Acta. 708, pp. 1-14. https://doi.org/10.1016/j.tca.2021.179133
Thermal Fatigue Life of Ball Grid Array (BGA) Solder Joints Made From Different Alloy Compositions
Depiver, Joshua Adeniyi, Sabuj, Mallik and Amalu, Emeka H 2021. Thermal Fatigue Life of Ball Grid Array (BGA) Solder Joints Made From Different Alloy Compositions. Engineering Failure Analysis. 125, pp. 1-26. https://doi.org/10.1016/j.engfailanal.2021.105447
Thermo-mechanical reliability studies of lead-free solder interconnects
Depiver, Joshua Adeniyi 2021. Thermo-mechanical reliability studies of lead-free solder interconnects. Thesis
Effective solder for improved thermo-mechanical reliability of solder joints in ball grid array (BGA) soldered on printed circuit board (PCB)
Depiver, Joshua Adeniyi, Sabuj, Mallik and Amalu, Emeka H 2020. Effective solder for improved thermo-mechanical reliability of solder joints in ball grid array (BGA) soldered on printed circuit board (PCB). Springer. https://doi.org/10.1007/s11664-020-08525-9
Solder joint failures under thermo-mechanical loading conditions – a review
Depiver, Joshua Adeniyi, Mallik, Sabuj and Harmanto, Dani 2020. Solder joint failures under thermo-mechanical loading conditions – a review. Advances in Materials and Processing Technologies. https://doi.org/10.1080/2374068X.2020.1751514
Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageing
Depiver, Joshua Adeniyi, Mallik, Sabuj, Amalu, Emeka H and Harmanto, Dani 2019. Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageing. IEEE Xplore.
Creep response of various solders used in soldering ball grid array (BGA) on printed circuit board (PCB)
Depiver, Joshua Adeniyi, Mallik, Sabuj and Amalu, Emeka H 2019. Creep response of various solders used in soldering ball grid array (BGA) on printed circuit board (PCB). Newsroom Limited.
Effect of reflow profile parameters on surface mount chip resistor solder joint shear strength.
Bernasko, Peter K., Mallik, Sabuj and Takyi, Gabriel 2014. Effect of reflow profile parameters on surface mount chip resistor solder joint shear strength. International Journal of Materials Science and Applications. https://doi.org/10.11648.j.ijmsa.20140305.27
Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics.
Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I., Mallik, Sabuj and Otiaba, Kenny 2013. Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability. https://doi.org/10.1016/j.microrel.2013.08.006
The effect of thermal constriction on heat management in a microelectronic application.
Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I., Mallik, Sabuj and Otiaba, Kenny 2013. The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal. https://doi.org/10.1016/j.mejo.2013.10.011
Printing morphology and rheological characteristics of lead-free Sn-3Ag-0.5Cu (SAC) solder pastes.
Sharma, Ashutosh, Mallik, Sabuj, Ekere, Nduka N. and Jung, Jae-Pil 2014. Printing morphology and rheological characteristics of lead-free Sn-3Ag-0.5Cu (SAC) solder pastes. Journal of the Microelectronics and Packaging Society. https://doi.org/10.6117/kmeps.2014.21.4.083
CFD simulation of solder paste flow and deformation behaviours during stencil printing process.
Thakur, Vishal, Mallik, Sabuj and Vuppala, Vamsi 2015. CFD simulation of solder paste flow and deformation behaviours during stencil printing process. International Journal of Recent Advances in Mechanical Engineering. https://doi.org/10.14810/ijmech.2015.4101
Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint.
Bernasko, Peter K., Mallik, Sabuj and Takyi, Gabriel 2015. Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint. Soldering & Surface Mount Technology. https://doi.org/10.1108/SSMT-07-2013-0019
A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints.
Nath, Jyotishman, Mallik, Sabuj and Borah, Anil 2015. A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints. Journal of The Institution of Engineers (India): Series D. https://doi.org/10.1007/s40033-014-0063-3
Quantitative evaluation of voids in lead free solder joints.
Mallik, Sabuj, Njoku, Jude and Takyi, Gabriel 2015. Quantitative evaluation of voids in lead free solder joints. Applied Mechanics and Materials. https://doi.org/10.4028/www.scientific.net/AMM.772.284