Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint.

Journal article


Bernasko, Peter K., Mallik, Sabuj and Takyi, Gabriel 2015. Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint. Soldering & Surface Mount Technology. https://doi.org/10.1108/SSMT-07-2013-0019
AuthorsBernasko, Peter K., Mallik, Sabuj and Takyi, Gabriel
Abstract

Purpose – The purpose of this paper is to study the effect of intermetallic compound (IMC) layer thickness on the shear strength of surface-mount component 1206 chip resistor solder joints. Design/methodology/approach – To evaluate the shear strength and IMC thickness of the 1206 chip resistor solder joints, the test vehicles were conventionally reflowed for 480 seconds at a peak temperature of 240°C at different isothermal ageing times of 100, 200 and 300 hours. A cross-sectional study was conducted on the reflowed and aged 1206 chip resistor solder joints. The shear strength of the solder joints aged at 100, 200 and 300 hours was measured using a shear tester (Dage-4000PXY bond tester). Findings – It was found that the growth of IMC layer thickness increases as the ageing time increases at a constant temperature of 175°C, which resulted in a reduction of solder joint strength due to its brittle nature. It was also found that the shear strength of the reflowed 1206 chip resistor solder joint was higher than the aged joints. Moreover, it was revealed that the shear strength of the 1206 resistor solder joints aged at 100, 200 and 300 hours was influenced by the ageing reaction times. The results also indicate that an increase in ageing time and temperature does not have much influence on the formation and growth of Kirkendall voids. Research limitations/implications – A proper correlation between shear strength and fracture mode is required. Practical implications – The IMC thickness can be used to predict the shear strength of the component/printed circuit board pad solder joint. Originality/value – The shear strength of the 1206 chip resistor solder joint is a function of ageing time and temperature (°C). Therefore, it is vital to consider the shear strength of the surface-mount chip component in high-temperature electronics.

Purpose

– The purpose of this paper is to study the effect of intermetallic compound (IMC) layer thickness on the shear strength of surface-mount component 1206 chip resistor solder joints.

Design/methodology/approach

– To evaluate the shear strength and IMC thickness of the 1206 chip resistor solder joints, the test vehicles were conventionally reflowed for 480 seconds at a peak temperature of 240°C at different isothermal ageing times of 100, 200 and 300 hours. A cross-sectional study was conducted on the reflowed and aged 1206 chip resistor solder joints. The shear strength of the solder joints aged at 100, 200 and 300 hours was measured using a shear tester (Dage-4000PXY bond tester).

Findings

– It was found that the growth of IMC layer thickness increases as the ageing time increases at a constant temperature of 175°C, which resulted in a reduction of solder joint strength due to its brittle nature. It was also found that the shear strength of the reflowed 1206 chip resistor solder joint was higher than the aged joints. Moreover, it was revealed that the shear strength of the 1206 resistor solder joints aged at 100, 200 and 300 hours was influenced by the ageing reaction times. The results also indicate that an increase in ageing time and temperature does not have much influence on the formation and growth of Kirkendall voids.

Research limitations/implications

– A proper correlation between shear strength and fracture mode is required.

Practical implications

– The IMC thickness can be used to predict the shear strength of the component/printed circuit board pad solder joint.

Originality/value

– The shear strength of the 1206 chip resistor solder joint is a function of ageing time and temperature (°C). Therefore, it is vital to consider the shear strength of the surface-mount chip component in high-temperature electronics.

KeywordsIntermetallic compounds (IC); Soldering; Solder joint
Year2015
JournalSoldering & Surface Mount Technology
PublisherEmerald
ISSN09540911
Digital Object Identifier (DOI)https://doi.org/10.1108/SSMT-07-2013-0019
Web address (URL)http://hdl.handle.net/10545/622569
hdl:10545/622569
Publication dates02 Feb 2015
Publication process dates
Deposited07 Apr 2018, 11:14
Rights

Archived with thanks to Soldering & Surface Mount Technology

ContributorsUniversity of Greenwich and Kwame Nkrumah University of Science and Technology
File
File Access Level
Open
Permalink -

https://repository.derby.ac.uk/item/95543/effect-of-intermetallic-compound-layer-thickness-on-the-shear-strength-of-1206-chip-resistor-solder-joint

Download files

  • 42
    total views
  • 0
    total downloads
  • 5
    views this month
  • 0
    downloads this month

Export as

Related outputs

A review of advancements in synthesis, manufacturing and properties of environment friendly biobased Polyfurfuryl Alcohol Resin and its Composites
Odiyi, D., Sharif, T., Choudhry, R., Mallik, S. and Shah S.Z.H 2023. A review of advancements in synthesis, manufacturing and properties of environment friendly biobased Polyfurfuryl Alcohol Resin and its Composites. Composites Part B: Engineering. 267, pp. 1-15. https://doi.org/10.1016/j.compositesb.2023.111034
An Empirical Study on Convective Drying of Ginger Rhizomes Leveraging Environmental Stress Chambers and Linear Heat Conduction Methodology
Depiver, J. and Mallik, S. 2023. An Empirical Study on Convective Drying of Ginger Rhizomes Leveraging Environmental Stress Chambers and Linear Heat Conduction Methodology. Agriculture. 13 (7), pp. 1-28. https://doi.org/10.3390/agriculture13071322
Effects of reflow profile and miniaturisation on integrity of solder joints in surface mount chip resistor
Njoku, J. E., Amalu, E. H., Ekere, N., Mallik, S., Ekpu, M. and Ogbodo, E. A. 2023. Effects of reflow profile and miniaturisation on integrity of solder joints in surface mount chip resistor. Journal of Electronic Materials. 52, p. 3786–3796. https://doi.org/10.1007/s11664-023-10340-x
Characterising Solder Materials from Random Vibration Response of their Interconnects in BGA Packaging
DEPIVER, J., Mallik, S. and Amalu, E. H. 2023. Characterising Solder Materials from Random Vibration Response of their Interconnects in BGA Packaging. Journal of Electronic Materials. pp. 1-17. https://doi.org/10.1007/s11664-023-10394-x
Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications
Depiver, Joshua Adeniyi, Sabuj, Mallik, Amalu, Emeka H and Lu, Yiling 2021. Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications. Production and Manufacturing Research.
Cure mechanism and kinetic prediction of biobased glass/polyfurfuryl alcohol prepreg by model-free kinetics
Odiyi, D., Sharif, T., Choudhry, R.S. and Mallik, S. 2022. Cure mechanism and kinetic prediction of biobased glass/polyfurfuryl alcohol prepreg by model-free kinetics. Thermochimica Acta. 708, pp. 1-14. https://doi.org/10.1016/j.tca.2021.179133
Thermal Fatigue Life of Ball Grid Array (BGA) Solder Joints Made From Different Alloy Compositions
Depiver, Joshua Adeniyi, Sabuj, Mallik and Amalu, Emeka H 2021. Thermal Fatigue Life of Ball Grid Array (BGA) Solder Joints Made From Different Alloy Compositions. Engineering Failure Analysis. 125, pp. 1-26. https://doi.org/10.1016/j.engfailanal.2021.105447
Comparing and benchmarking fatigue behaviours of various sac solders under thermo-mechanical loading
Depiver, Joshua Adeniyi, Mallik, Sabuj and Amalu, Emeka H 2020. Comparing and benchmarking fatigue behaviours of various sac solders under thermo-mechanical loading. IEEE. https://doi.org/10.1109/ESTC48849.2020.9229699
Effective solder for improved thermo-mechanical reliability of solder joints in ball grid array (BGA) soldered on printed circuit board (PCB)
Depiver, Joshua Adeniyi, Sabuj, Mallik and Amalu, Emeka H 2020. Effective solder for improved thermo-mechanical reliability of solder joints in ball grid array (BGA) soldered on printed circuit board (PCB). Springer. https://doi.org/10.1007/s11664-020-08525-9
Solder joint failures under thermo-mechanical loading conditions – a review
Depiver, Joshua Adeniyi, Mallik, Sabuj and Harmanto, Dani 2020. Solder joint failures under thermo-mechanical loading conditions – a review. Advances in Materials and Processing Technologies. https://doi.org/10.1080/2374068X.2020.1751514
Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageing
Depiver, Joshua Adeniyi, Mallik, Sabuj, Amalu, Emeka H and Harmanto, Dani 2019. Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageing. IEEE Xplore.
Creep response of various solders used in soldering ball grid array (BGA) on printed circuit board (PCB)
Depiver, Joshua Adeniyi, Mallik, Sabuj and Amalu, Emeka H 2019. Creep response of various solders used in soldering ball grid array (BGA) on printed circuit board (PCB). Newsroom Limited.
Effect of reflow profile parameters on surface mount chip resistor solder joint shear strength.
Bernasko, Peter K., Mallik, Sabuj and Takyi, Gabriel 2014. Effect of reflow profile parameters on surface mount chip resistor solder joint shear strength. International Journal of Materials Science and Applications. https://doi.org/10.11648.j.ijmsa.20140305.27
Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics.
Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I., Mallik, Sabuj and Otiaba, Kenny 2013. Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability. https://doi.org/10.1016/j.microrel.2013.08.006
The effect of thermal constriction on heat management in a microelectronic application.
Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I., Mallik, Sabuj and Otiaba, Kenny 2013. The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal. https://doi.org/10.1016/j.mejo.2013.10.011
Printing morphology and rheological characteristics of lead-free Sn-3Ag-0.5Cu (SAC) solder pastes.
Sharma, Ashutosh, Mallik, Sabuj, Ekere, Nduka N. and Jung, Jae-Pil 2014. Printing morphology and rheological characteristics of lead-free Sn-3Ag-0.5Cu (SAC) solder pastes. Journal of the Microelectronics and Packaging Society. https://doi.org/10.6117/kmeps.2014.21.4.083
CFD simulation of solder paste flow and deformation behaviours during stencil printing process.
Thakur, Vishal, Mallik, Sabuj and Vuppala, Vamsi 2015. CFD simulation of solder paste flow and deformation behaviours during stencil printing process. International Journal of Recent Advances in Mechanical Engineering. https://doi.org/10.14810/ijmech.2015.4101
A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints.
Nath, Jyotishman, Mallik, Sabuj and Borah, Anil 2015. A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints. Journal of The Institution of Engineers (India): Series D. https://doi.org/10.1007/s40033-014-0063-3
Quantitative evaluation of voids in lead free solder joints.
Mallik, Sabuj, Njoku, Jude and Takyi, Gabriel 2015. Quantitative evaluation of voids in lead free solder joints. Applied Mechanics and Materials. https://doi.org/10.4028/www.scientific.net/AMM.772.284