Printing morphology and rheological characteristics of lead-free Sn-3Ag-0.5Cu (SAC) solder pastes.
Journal article
Sharma, Ashutosh, Mallik, Sabuj, Ekere, Nduka N. and Jung, Jae-Pil 2014. Printing morphology and rheological characteristics of lead-free Sn-3Ag-0.5Cu (SAC) solder pastes. Journal of the Microelectronics and Packaging Society. https://doi.org/10.6117/kmeps.2014.21.4.083
| Authors | Sharma, Ashutosh, Mallik, Sabuj, Ekere, Nduka N. and Jung, Jae-Pil |
|---|---|
| Abstract | Solder paste plays a crucial role as the widely used joining material in surface mount technology (SMT). The understanding of its behaviour and properties is essential to ensure the proper functioning of the electronic assemblies. The composition of the solder paste is known to be directly related to its rheological behaviour. This paper provides a brief overview of the solder paste behaviour of four different solder paste formulations, stencil printing processes, and techniques to characterize solder paste behaviour adequately. The solder pastes are based on the Sn-3.0Ag-0.5Cu alloy, are different in their particle size, metal content and flux system. The solder pastes are characterized in terms of solder particle size and shape as well as the rheological characterizations such as oscillatory sweep tests, viscosity, and creep recovery behaviour of pastes. |
| Keywords | Solder paste simulation; Flip chip packaging; Stencil printing process simulation; Viscosity |
| Year | 2014 |
| Journal | Journal of the Microelectronics and Packaging Society |
| Publisher | The Korean Microelectronics and Packaging Society |
| ISSN | 12269360 |
| Digital Object Identifier (DOI) | https://doi.org/10.6117/kmeps.2014.21.4.083 |
| Web address (URL) | http://hdl.handle.net/10545/622571 |
| hdl:10545/622571 | |
| Publication dates | 30 Dec 2014 |
| Publication process dates | |
| Deposited | 07 Apr 2018, 11:36 |
| Rights | Archived with thanks to Journal of the Microelectronics and Packaging Society |
| Contributors | University of Seoul, University of Greenwich and University of Wolverhampton |
| File | File Access Level Open |
| File | File Access Level Open |
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