Printing morphology and rheological characteristics of lead-free Sn-3Ag-0.5Cu (SAC) solder pastes.
Journal article
Sharma, Ashutosh, Mallik, Sabuj, Ekere, Nduka N. and Jung, Jae-Pil 2014. Printing morphology and rheological characteristics of lead-free Sn-3Ag-0.5Cu (SAC) solder pastes. Journal of the Microelectronics and Packaging Society. https://doi.org/10.6117/kmeps.2014.21.4.083
| Authors | Sharma, Ashutosh, Mallik, Sabuj, Ekere, Nduka N. and Jung, Jae-Pil |
|---|---|
| Abstract | Solder paste plays a crucial role as the widely used joining material in surface mount technology (SMT). The understanding of its behaviour and properties is essential to ensure the proper functioning of the electronic assemblies. The composition of the solder paste is known to be directly related to its rheological behaviour. This paper provides a brief overview of the solder paste behaviour of four different solder paste formulations, stencil printing processes, and techniques to characterize solder paste behaviour adequately. The solder pastes are based on the Sn-3.0Ag-0.5Cu alloy, are different in their particle size, metal content and flux system. The solder pastes are characterized in terms of solder particle size and shape as well as the rheological characterizations such as oscillatory sweep tests, viscosity, and creep recovery behaviour of pastes. |
| Keywords | Solder paste simulation; Flip chip packaging; Stencil printing process simulation; Viscosity |
| Year | 2014 |
| Journal | Journal of the Microelectronics and Packaging Society |
| Publisher | The Korean Microelectronics and Packaging Society |
| ISSN | 12269360 |
| Digital Object Identifier (DOI) | https://doi.org/10.6117/kmeps.2014.21.4.083 |
| Web address (URL) | http://hdl.handle.net/10545/622571 |
| hdl:10545/622571 | |
| Publication dates | 30 Dec 2014 |
| Publication process dates | |
| Deposited | 07 Apr 2018, 11:36 |
| Rights | Archived with thanks to Journal of the Microelectronics and Packaging Society |
| Contributors | University of Seoul, University of Greenwich and University of Wolverhampton |
| File | File Access Level Open |
| File | File Access Level Open |
Permalink -
https://repository.derby.ac.uk/item/95429/printing-morphology-and-rheological-characteristics-of-lead-free-sn-3ag-0-5cu-sac-solder-pastes
Download files
40
total views13
total downloads1
views this month0
downloads this month
Export as
Related outputs
A review of advancements in synthesis, manufacturing and properties of environment friendly biobased Polyfurfuryl Alcohol Resin and its Composites
Odiyi, D., Sharif, T., Choudhry, R., Mallik, S. and Shah S.Z.H 2023. A review of advancements in synthesis, manufacturing and properties of environment friendly biobased Polyfurfuryl Alcohol Resin and its Composites. Composites Part B: Engineering. 267, pp. 1-15. https://doi.org/10.1016/j.compositesb.2023.111034An Empirical Study on Convective Drying of Ginger Rhizomes Leveraging Environmental Stress Chambers and Linear Heat Conduction Methodology
Depiver, J. and Mallik, S. 2023. An Empirical Study on Convective Drying of Ginger Rhizomes Leveraging Environmental Stress Chambers and Linear Heat Conduction Methodology. Agriculture. 13 (7), pp. 1-28. https://doi.org/10.3390/agriculture13071322Effects of reflow profile and miniaturisation on integrity of solder joints in surface mount chip resistor
Njoku, J. E., Amalu, E. H., Ekere, N., Mallik, S., Ekpu, M. and Ogbodo, E. A. 2023. Effects of reflow profile and miniaturisation on integrity of solder joints in surface mount chip resistor. Journal of Electronic Materials. 52, p. 3786–3796. https://doi.org/10.1007/s11664-023-10340-x
Characterising Solder Materials from Random Vibration Response of their Interconnects in BGA Packaging
DEPIVER, J., Mallik, S. and Amalu, E. H. 2023. Characterising Solder Materials from Random Vibration Response of their Interconnects in BGA Packaging. Journal of Electronic Materials. pp. 1-17. https://doi.org/10.1007/s11664-023-10394-xCreep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications
Depiver, Joshua Adeniyi, Sabuj, Mallik, Amalu, Emeka H and Lu, Yiling 2021. Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications. Production and Manufacturing Research.Cure mechanism and kinetic prediction of biobased glass/polyfurfuryl alcohol prepreg by model-free kinetics
Odiyi, D., Sharif, T., Choudhry, R.S. and Mallik, S. 2022. Cure mechanism and kinetic prediction of biobased glass/polyfurfuryl alcohol prepreg by model-free kinetics. Thermochimica Acta. 708, pp. 1-14. https://doi.org/10.1016/j.tca.2021.179133Thermal Fatigue Life of Ball Grid Array (BGA) Solder Joints Made From Different Alloy Compositions
Depiver, Joshua Adeniyi, Sabuj, Mallik and Amalu, Emeka H 2021. Thermal Fatigue Life of Ball Grid Array (BGA) Solder Joints Made From Different Alloy Compositions. Engineering Failure Analysis. 125, pp. 1-26. https://doi.org/10.1016/j.engfailanal.2021.105447Comparing and benchmarking fatigue behaviours of various sac solders under thermo-mechanical loading
Depiver, Joshua Adeniyi, Mallik, Sabuj and Amalu, Emeka H 2020. Comparing and benchmarking fatigue behaviours of various sac solders under thermo-mechanical loading. IEEE. https://doi.org/10.1109/ESTC48849.2020.9229699Effective solder for improved thermo-mechanical reliability of solder joints in ball grid array (BGA) soldered on printed circuit board (PCB)
Depiver, Joshua Adeniyi, Sabuj, Mallik and Amalu, Emeka H 2020. Effective solder for improved thermo-mechanical reliability of solder joints in ball grid array (BGA) soldered on printed circuit board (PCB). Springer. https://doi.org/10.1007/s11664-020-08525-9Solder joint failures under thermo-mechanical loading conditions – a review
Depiver, Joshua Adeniyi, Mallik, Sabuj and Harmanto, Dani 2020. Solder joint failures under thermo-mechanical loading conditions – a review. Advances in Materials and Processing Technologies. https://doi.org/10.1080/2374068X.2020.1751514Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageing
Depiver, Joshua Adeniyi, Mallik, Sabuj, Amalu, Emeka H and Harmanto, Dani 2019. Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageing. IEEE Xplore.Creep response of various solders used in soldering ball grid array (BGA) on printed circuit board (PCB)
Depiver, Joshua Adeniyi, Mallik, Sabuj and Amalu, Emeka H 2019. Creep response of various solders used in soldering ball grid array (BGA) on printed circuit board (PCB). Newsroom Limited.Effect of reflow profile parameters on surface mount chip resistor solder joint shear strength.
Bernasko, Peter K., Mallik, Sabuj and Takyi, Gabriel 2014. Effect of reflow profile parameters on surface mount chip resistor solder joint shear strength. International Journal of Materials Science and Applications. https://doi.org/10.11648.j.ijmsa.20140305.27Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics.
Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I., Mallik, Sabuj and Otiaba, Kenny 2013. Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability. https://doi.org/10.1016/j.microrel.2013.08.006The effect of thermal constriction on heat management in a microelectronic application.
Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I., Mallik, Sabuj and Otiaba, Kenny 2013. The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal. https://doi.org/10.1016/j.mejo.2013.10.011CFD simulation of solder paste flow and deformation behaviours during stencil printing process.
Thakur, Vishal, Mallik, Sabuj and Vuppala, Vamsi 2015. CFD simulation of solder paste flow and deformation behaviours during stencil printing process. International Journal of Recent Advances in Mechanical Engineering. https://doi.org/10.14810/ijmech.2015.4101Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint.
Bernasko, Peter K., Mallik, Sabuj and Takyi, Gabriel 2015. Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint. Soldering & Surface Mount Technology. https://doi.org/10.1108/SSMT-07-2013-0019A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints.
Nath, Jyotishman, Mallik, Sabuj and Borah, Anil 2015. A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints. Journal of The Institution of Engineers (India): Series D. https://doi.org/10.1007/s40033-014-0063-3