Effects of reflow profile and miniaturisation on integrity of solder joints in surface mount chip resistor
Journal article
Njoku, J. E., Amalu, E. H., Ekere, N., Mallik, S., Ekpu, M. and Ogbodo, E. A. 2023. Effects of reflow profile and miniaturisation on integrity of solder joints in surface mount chip resistor. Journal of Electronic Materials. 52, p. 3786–3796. https://doi.org/10.1007/s11664-023-10340-x
| Authors | Njoku, J. E., Amalu, E. H., Ekere, N., Mallik, S., Ekpu, M. and Ogbodo, E. A. |
|---|---|
| Abstract | Integrity of solder joints of components in an electronic device is critical to the device reliability. Miniaturisation manufacturing trend in electronic products development has continued to challenge the shear strength of the solder joints in these devices and necessitates implementation of optimal reflow profile to achieve maximum strength of the joints. This research proposes optimal parameter combination of reflow profile factors which demonstrate potential of delivering maximum shear strength of solder joint. The Taguchi design of experiment (DoE) is employed to generate eight orthogonal array designs of L24 of reflow profiles. The factors/parameters investigated are preheat gradient, time above liquidus (TAL), peak temperature and cooling rate. Three test vehicles of varying solder joint sizes are made from R1206, R0805 and R0603 resistors. Reflow profile number 3 constituting 1.2 °C/s preheat, 45 s TAL, 245 °C peak temperature and 60% cooling rate is optimal because it yielded joints with highest strength and circa 4 µm thickness of intermetallic compound (IMC). Solder joint shear strength decreases with decrease in size of lead-free joint irrespective of reflow profile implemented. These results will be useful to electronic packaging and reliability engineers faced with challenges of improving device operational mechanical performance in the continuing product miniaturisation trend. |
| Keywords | Reflow profile; Mechanical reliability; Resistor solder joints; Chip resistor |
| Year | 2023 |
| Journal | Journal of Electronic Materials |
| Journal citation | 52, p. 3786–3796 |
| Publisher | Springer |
| ISSN | 0361-5235 |
| Digital Object Identifier (DOI) | https://doi.org/10.1007/s11664-023-10340-x |
| Web address (URL) | https://link.springer.com/article/10.1007/s11664-023-10340-x |
| Accepted author manuscript | License All rights reserved File Access Level Controlled |
| Output status | Published |
| Publication dates | |
| Online | 25 Mar 2023 |
| Publication process dates | |
| Accepted | 28 Feb 2023 |
| Deposited | 27 Mar 2023 |
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