The effect of thermal constriction on heat management in a microelectronic application.

Journal article


Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I., Mallik, Sabuj and Otiaba, Kenny 2013. The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal. https://doi.org/10.1016/j.mejo.2013.10.011
AuthorsEkpu, Mathias, Bhatti, Raj, Okereke, Michael I., Mallik, Sabuj and Otiaba, Kenny
Abstract

Thermal contact constriction between a chip and a heat sink assembly of a microelectronic application is investigated in order to access the thermal performance. The finite element model (FEM) of the electronic device developed using ANSYS software was analysed while the micro-contact and micro-gap thermal resistances were numerically analysed by the use of MATLAB. In addition, the effects of four major factors (contact pressure, micro-hardness, root-mean-squared (RMS) surface roughness, and mean absolute surface slope) on thermal contact resistance were investigated. Two lead-free solders (SAC305 and SAC405) were used as thermal interface materials in this study to bridge the interface created between a chip and a heat sink. The results from this research showed that an increase in three of the factors reduces thermal contact resistance while the reverse is the case for RMS surface roughness. In addition, the use of SAC305 and SAC405 resulted in a temperature drop across the microelectronic device. These results might aid engineers to produce products with less RMS surface roughness thereby improving thermal efficiency of the microelectronic application.

KeywordsThermal constriction; Micro-contact; Heat sink
Year2013
JournalMicroelectronics Journal
PublisherElsevier
ISSN00262692
Digital Object Identifier (DOI)https://doi.org/10.1016/j.mejo.2013.10.011
Web address (URL)http://hdl.handle.net/10545/622572
hdl:10545/622572
Publication dates14 Nov 2013
Publication process dates
Deposited07 Apr 2018, 11:59
Rights

Archived with thanks to Microelectronics Journal

ContributorsUniversity of Greenwich
File
File Access Level
Open
Permalink -

https://repository.derby.ac.uk/item/9501v/the-effect-of-thermal-constriction-on-heat-management-in-a-microelectronic-application

Download files

  • 35
    total views
  • 0
    total downloads
  • 0
    views this month
  • 0
    downloads this month

Export as

Related outputs

A review of advancements in synthesis, manufacturing and properties of environment friendly biobased Polyfurfuryl Alcohol Resin and its Composites
Odiyi, D., Sharif, T., Choudhry, R., Mallik, S. and Shah S.Z.H 2023. A review of advancements in synthesis, manufacturing and properties of environment friendly biobased Polyfurfuryl Alcohol Resin and its Composites. Composites Part B: Engineering. 267, pp. 1-15. https://doi.org/10.1016/j.compositesb.2023.111034
An Empirical Study on Convective Drying of Ginger Rhizomes Leveraging Environmental Stress Chambers and Linear Heat Conduction Methodology
Depiver, J. and Mallik, S. 2023. An Empirical Study on Convective Drying of Ginger Rhizomes Leveraging Environmental Stress Chambers and Linear Heat Conduction Methodology. Agriculture. 13 (7), pp. 1-28. https://doi.org/10.3390/agriculture13071322
Effects of reflow profile and miniaturisation on integrity of solder joints in surface mount chip resistor
Njoku, J. E., Amalu, E. H., Ekere, N., Mallik, S., Ekpu, M. and Ogbodo, E. A. 2023. Effects of reflow profile and miniaturisation on integrity of solder joints in surface mount chip resistor. Journal of Electronic Materials. 52, p. 3786–3796. https://doi.org/10.1007/s11664-023-10340-x
Characterising Solder Materials from Random Vibration Response of their Interconnects in BGA Packaging
DEPIVER, J., Mallik, S. and Amalu, E. H. 2023. Characterising Solder Materials from Random Vibration Response of their Interconnects in BGA Packaging. Journal of Electronic Materials. pp. 1-17. https://doi.org/10.1007/s11664-023-10394-x
Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications
Depiver, Joshua Adeniyi, Sabuj, Mallik, Amalu, Emeka H and Lu, Yiling 2021. Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications. Production and Manufacturing Research.
Cure mechanism and kinetic prediction of biobased glass/polyfurfuryl alcohol prepreg by model-free kinetics
Odiyi, D., Sharif, T., Choudhry, R.S. and Mallik, S. 2022. Cure mechanism and kinetic prediction of biobased glass/polyfurfuryl alcohol prepreg by model-free kinetics. Thermochimica Acta. 708, pp. 1-14. https://doi.org/10.1016/j.tca.2021.179133
Thermal Fatigue Life of Ball Grid Array (BGA) Solder Joints Made From Different Alloy Compositions
Depiver, Joshua Adeniyi, Sabuj, Mallik and Amalu, Emeka H 2021. Thermal Fatigue Life of Ball Grid Array (BGA) Solder Joints Made From Different Alloy Compositions. Engineering Failure Analysis. 125, pp. 1-26. https://doi.org/10.1016/j.engfailanal.2021.105447
Comparing and benchmarking fatigue behaviours of various sac solders under thermo-mechanical loading
Depiver, Joshua Adeniyi, Mallik, Sabuj and Amalu, Emeka H 2020. Comparing and benchmarking fatigue behaviours of various sac solders under thermo-mechanical loading. IEEE. https://doi.org/10.1109/ESTC48849.2020.9229699
Effective solder for improved thermo-mechanical reliability of solder joints in ball grid array (BGA) soldered on printed circuit board (PCB)
Depiver, Joshua Adeniyi, Sabuj, Mallik and Amalu, Emeka H 2020. Effective solder for improved thermo-mechanical reliability of solder joints in ball grid array (BGA) soldered on printed circuit board (PCB). Springer. https://doi.org/10.1007/s11664-020-08525-9
Solder joint failures under thermo-mechanical loading conditions – a review
Depiver, Joshua Adeniyi, Mallik, Sabuj and Harmanto, Dani 2020. Solder joint failures under thermo-mechanical loading conditions – a review. Advances in Materials and Processing Technologies. https://doi.org/10.1080/2374068X.2020.1751514
Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageing
Depiver, Joshua Adeniyi, Mallik, Sabuj, Amalu, Emeka H and Harmanto, Dani 2019. Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageing. IEEE Xplore.
Creep response of various solders used in soldering ball grid array (BGA) on printed circuit board (PCB)
Depiver, Joshua Adeniyi, Mallik, Sabuj and Amalu, Emeka H 2019. Creep response of various solders used in soldering ball grid array (BGA) on printed circuit board (PCB). Newsroom Limited.
Effect of reflow profile parameters on surface mount chip resistor solder joint shear strength.
Bernasko, Peter K., Mallik, Sabuj and Takyi, Gabriel 2014. Effect of reflow profile parameters on surface mount chip resistor solder joint shear strength. International Journal of Materials Science and Applications. https://doi.org/10.11648.j.ijmsa.20140305.27
Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics.
Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I., Mallik, Sabuj and Otiaba, Kenny 2013. Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability. https://doi.org/10.1016/j.microrel.2013.08.006
Printing morphology and rheological characteristics of lead-free Sn-3Ag-0.5Cu (SAC) solder pastes.
Sharma, Ashutosh, Mallik, Sabuj, Ekere, Nduka N. and Jung, Jae-Pil 2014. Printing morphology and rheological characteristics of lead-free Sn-3Ag-0.5Cu (SAC) solder pastes. Journal of the Microelectronics and Packaging Society. https://doi.org/10.6117/kmeps.2014.21.4.083
CFD simulation of solder paste flow and deformation behaviours during stencil printing process.
Thakur, Vishal, Mallik, Sabuj and Vuppala, Vamsi 2015. CFD simulation of solder paste flow and deformation behaviours during stencil printing process. International Journal of Recent Advances in Mechanical Engineering. https://doi.org/10.14810/ijmech.2015.4101
Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint.
Bernasko, Peter K., Mallik, Sabuj and Takyi, Gabriel 2015. Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint. Soldering & Surface Mount Technology. https://doi.org/10.1108/SSMT-07-2013-0019
A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints.
Nath, Jyotishman, Mallik, Sabuj and Borah, Anil 2015. A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints. Journal of The Institution of Engineers (India): Series D. https://doi.org/10.1007/s40033-014-0063-3
Quantitative evaluation of voids in lead free solder joints.
Mallik, Sabuj, Njoku, Jude and Takyi, Gabriel 2015. Quantitative evaluation of voids in lead free solder joints. Applied Mechanics and Materials. https://doi.org/10.4028/www.scientific.net/AMM.772.284